Method of manufacturing a semiconductor light detector

ABSTRACT

A semiconductor light detector includes a first semiconductor layer of a first conductivity type having a multi-layer structure including a light absorbing layer and an avalanche multiplicating layer, an annular second semiconductor layer formed on the first semiconductor layer, a light detecting region formed by doping an impurity of a second conductivity type in a surface region of the first semiconductor layer, in such a manner that a peripheral portion of the light detecting region is located outside an inner periphery of the second semiconductor layer, the light deflecting region defining a first p-n junction in combination with the first semiconductor layer, and a guard ring formed by doping an impurity of the second conductivity type in a surface region of the second semiconductor layer to surround the peripheral portion of the light receiving region with the first semiconductor layer, the second p-n junction having a concentration gradient lower than that of the first p-n junction. By virtue of the presence of the second semiconductor layer, the junction depth of the peripheral portion of the light detecting region is less than that of the central portion of the light detecting region, and the junction depth of the guard ring is greater than that of the peripheral portion of the light detecting region. As a result, a sufficient guard ring effect can be obtained without a guard ring having a great junction depth.

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a semiconductor light detectorutilizing an avalanche effect and, more particularly, to a semiconductorlight detector having an improved guard ring structure and a method ofmanufacturing the same.

2. Description of the Related Art

In recent years, an avalanche photo diode (to hereinafter be referred toas an APD) has been used as a high-sensitivity light detector in suchfields as optical fiber communication systems. An APD is a deviceutilizing avalanche-carrier multiplication of a semiconductor crystal,and has an avalanche region having a high electric field inside thedevice. For this reason, a guard ring structure is important to preventlocal breakdown caused by electric field concentration in the avalancheregion; in particular, in the peripheral portion of the avalancheregion.

An optical communication system generally uses an APD which includes alight detection layer (light absorption layer) consisting of GaInAs(having a composition lattice-matched with InP) having high sensitivityin a low-loss range (wavelength; 1.3 to 1.5 μm) of a quartz opticalfiber, carriers generated in the light receiving layer being subjectedto avalanche multiplication by InP.

Since a high electric field region necessary for avalanchemultiplication is formed at a front portion of a p-n junction having asharp concentration gradient (to hereinafter be referred to as a steeplygraded junction), electric field concentration tends to occur at the endportion of the front portion, due to the curvature of the end portion,as a result of which a so-called local breakdown tends easily to occur.

In order to solve the above problem, a guard ring is formed. Byarranging the guard ring, a p-n junction having a slow concentrationgradient (to be referred to as a moderately graded junction hereinafter)is formed at the end portion of the front portion of the steeply gradedjunction.

In the moderately graded junction, a breakdown voltage is generally highand an electric field concentration effect due to the curvature isinsufficient. Therefore, the guard ring can suppress the localbreakdown. At this time, the depth of the moderately graded junctionmust be slightly larger than that of the steeply graded junction. If thesteeply graded junction is too close to the moderately graded junction,the effect of the moderately graded junction is decreased. In addition,a method of equivalently increasing the curvature of an impurity dopedinterface can effectively suppress the local breakdown.

A conventional APD wherein a guard ring is formed will be describedhereinafter with reference to FIGS. 1 to 4.

FIG. 1 is a sectional view showing an example of a conventional APDdisclosed in Lecture Papers of the 46th Lectures of the Japan Society ofApplied Physics, 1985, Autumn. In FIG. 1, an n-InP buffer layer 2, an n⁻-GaInAs light absorbing layer 3, an n⁻ -GaInAsP (composition having anabsorption edge wavelength of 1.3 μm) intermediate layer 4, an n-InPavalanche multiplication/electric field relaxation layer 5, an n⁻ -InPwindow layer 6, a p-type guard ring 8 for forming a moderately gradedjunction, a p-type light receiving region 9 for forming a steeply gradedjunction, an insulating layer 11, and a non-reflection coating layer aresequentially formed on an n-InP substrate 1. An electrode 13 is formedon an exposing surface of the light detection layer 9, and an electrode14 is formed on a lower surface of the substrate 1.

In the APD having the above structure, a depletion layer extends underthe p-type regions 8 and 9, and carriers generated in the lightabsorbing layer 3 are guided to a high electric field regionconcentrated in the p-n junction region and are subjected to avalanchemultiplication. In the optical communication APD, in order to minimize adecrease in response speed due to the avalanche multiplication, thelight detecting region 9 is generally formed close to the n-InP layer 5to decrease the width of the high electric field region. Therefore, thejunction defined by the guard ring 8 is formed to extend in the n-InPlayer 5. However, since the impurity concentration of the n-InP layer 5is relatively high, an effect of the moderately graded junction on theinterface of the guard ring 8 tends to be insufficient, thus easilycausing local breakdown. In the prior art shown in FIG. 1, a shallowguard ring is expanded in a longitudinal direction to prevent the localbreakdown. This is equivalent to an increase in curvature of theperipheral portion of the guard ring. In such a prior art, however, theelectric field value of the light detection layer 3 tends to increasebecause the moderately graded junction is deep under the steeply gradedjunction, and a current generated in a heterointerface or a dark currentdue to a tunnel current in the light detection layer 3 tends to beincreased. The above problems are posed when the impurity concentrationof the n-InP layer 5 is increased and the thickness thereof is decreasedto achieve a high-speed operation.

FIG. 2 is a sectional view showing a prior art wherein the shape of theinterface portion of the steeply graded junction is changed and theequivalent curvature of the interface is increased. This prior art isdisclosed in the Institute of Electronics and Communication Engineers ofJapan, the National Meeting, Lecture Papers C--172, 1988, Autumn. Inthis prior art, a guard ring providing the moderately graded junction isnot formed, but only the shape of the interface portion of the steeplygraded junction prevents local breakdown. This moderately gradedjunction is formed by thermal diffusion of Zn, Cd, or the like. Acentral light detecting region (projection) is formed by selectiveforced diffusion of an impurity. As a result, a high electric fieldregion is formed in the central projection, and the electric fieldconcentration in the projection interface is decreased.

In such a structure, a dark current is not unnecessarily increased, ascompared with the prior art in FIG. 1, and an element almost free fromthe dark current can be obtained. In such a structure, however, in orderto relax the curvature of the peripheral front portion of the steeplygraded junction, relatively deep diffusion (about 6 μm) is performed,and the thickness of the n-InP layer 6 must be increased as comparedwith that in diffusion (diffusion depth: 1 to 2 μm) using a normalmoderately graded junction (guard ring). For this reason, cost isundesirably increased to perform crystal growth. In addition,controllability of the diffusion depth is degraded because of deepdiffusion, and flatness of the front portion of the diffusion region iseasily damaged. Therefore, the nonuniformity of the light detectionsensitivity undesirably tends to occur over the light detection region.In addition, when the front portion of the diffusion region approachesthe n-InP layer 5 in order to achieve a high-speed operation of thedevice, local breakdown in the front peripheral portion tends to occuragain. As a result, this structure is not suitable for a high-speed APD.

FIG. 3 shows a prior art wherein a part of the n-InP layer 5 on whichthe guard ring is to be formed is removed, and another n⁻ -InP layer 6is grown again. This prior art is disclosed in Japanese PatentDisclosure No. 61-220481. In this prior art, the guard ring providingthe moderately graded junction is formed in the front peripheral portionof the steeply graded junction. However, since the thickness of the n⁻-InP layer 6 grown again is relatively large, the moderately gradedjunction can hardly affect the light detection layer 3. In addition,since the diffusion depth is normal and the shape of the diffusion frontcan be deformed at a regrowth interface, a substantially ideal guardring structure can be obtained by performing optimization. Such anexcellent structure is suitable for a high-speed APD, and problems onits characteristics can be substantially solved.

The drawbacks of the above structure are, however, caused by the suchproblems in a manufacturing method that a regrowth interface exists inthe high electric field region and double crystal growth must beperformed. More specifically, a perfect regrowth interface is requiredto withstand a high electric field wherein avalanche multiplication canbe performed. Therefore, crystal regrowth almost free from an interfacelevel is required. For this reason, the following method has beenemployed. That is, so-called "melt back" (etching in a growth furnace bycrystal growth melt) is slightly performed by an LPE (liquid phaseepitaxy) to clean the surface. By employing this method, a substantiallyperfect regrowth interface can be obtained. However, since the LPE isemployed as a regrowth method, the following problems are posed. Forexample, a wafer size is limited, the flatness of the regrowth interfaceis easily damaged, and the number of factors to reduce a manufacturingyield is increased. In addition, since the thickness of the layer formedby the second crystal growth is large, i.e., 2 to 3 μm, cost isundesirably increased because of the second crystal growth.

FIG. 4 shows a prior art having the above advantages of the prior artsshown in FIGS. 1 and 2. This prior art is disclosed in Japanese PatentDisclosure No. 61-191082. In this prior art, the thickness of the n⁻-InP layer 6 is slightly increased, and the central light detectionregion portion is removed by etching or ion milling to obtain a smoothprofile. Thereafter, a moderately graded junction is formed. The guardring 8 providing the moderately graded junction is formed in the frontperipheral portion of the steeply graded junction. In the structureaccording to this prior art, the n⁻ -InP layer obtained by regrowth isnot required, and the diffusion depth of the steeply graded junction maybe relatively small. Therefore, the above problems are not posed.However, in such a prior art, the extremely high-precisioncontrollability of etching or ion milling is required, so that themanufacturing yield becomes low.

SUMMARY OF THE INVENTION

It is an object of the present invention to provide a semiconductorlight detector which can increase a breakdown voltage of a guard ring,and can decrease a dark current.

It is another object of the present invention to provide a method ofmanufacturing the semiconductor light detector at a high manufacturingyield without an increase in manufacturing cost.

According to the present invention, there is provided a semiconductorlight detector comprising a first semiconductor layer of a firstconductivity type having a multi-layer structure including a lightabsorbing layer and an avalanche multiplicating layer, an annular secondsemiconductor layer formed on the first semiconductor layer, a lightdetecting region formed by doping a impurity of a second conductivitytype in a surface region of the first semiconductor layer in such amanner that a peripheral portion of the light detecting region islocated outside an inner periphery of the second semiconductor layer,the light detecting region defining a first p-n junction with the firstsemiconductor layer, and a guard ring formed by doping an impurity ofthe second conductivity type in a surface region of the firstsemiconductor layer to surround the peripheral portion of the lightdetecting region, the guard ring defining a second p-n junction with thefirst semiconductor layer, the second p-n junction having aconcentration gradient smaller than that of the first p-n junction,wherein a junction depth of the peripheral portion of the lightdetecting region is smaller than that of a central portion of the lightdetecting region, and a junction depth of the guard ring is larger thanthat of the peripheral portion of the light detecting region.

According to the present invention, there is further provided a methodof manufacturing the semiconductor light detector, comprising the stepsof doping an impurity of a second conductivity type in a surface regionof a first semiconductor layer of a first conductivity type having amulti-layer structure including a light absorbing layer and an avalanchemultiplicating layer to form a guard ring, the guard ring defining asecond p-n junction, forming an annular second semiconductor layer on asurface of the first semiconductor layer corresponding to the guardring, forming a masking layer on a peripheral portion of the secondsemiconductor layer and a surface of the first semiconductor layeroutside the peripheral portion, and doping an impurity of a secondconductivity type in the first semiconductor layer using the maskinglayer as a mask in such a manner that a diffusion depth of a centralportion of the first semiconductor layer is larger than that of theguard ring, and that a diffusion depth of a peripheral portion of thefirst semiconductor layer is smaller than that of the guard ring so asto form a light detecting region, the light receiving region defining afirst p-n junction having a concentration gradient larger than that ofthe second p-n junction.

According to the present invention, there is further provided a methodof manufacturing the semiconductor light detector, comprising the stepsof forming a first mask layer including an annular window on a surfaceof a first semiconductor layer of a first conductivity type having amulti-layer structure including a light absorbing layer and an avalanchemultiplicating layer, selectively forming a spacing layer on the firstsemiconductor layer, the first semiconductor layer being exposed in theannular window, doping an impurity of a second conductivity type in asurface region of the first semiconductor layer through the spacinglayer to form a guard ring, the guard ring defining a second p-njunction, forming a second masking layer on a surface of the firstsemiconductor layer outside the second semiconductor layer, and dopingan impurity of the second conductivity type in the first semiconductorlayer using the second masking layer as a mask in such a manner that adiffusion depth of a central portion of the first semiconductor layer islarger than that of the guard ring and that a diffusion depth of aperipheral portion of the first semiconductor layer is smaller than thatof the guard ring so as to form a light detecting region, the lightdetecting region defining a first p-n junction having a concentrationgradient larger than that of the second p-n junction.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1 to 4 are sectional views showing a structure of a conventionalavalanche photodiode (APD);

FIG. 5 is a sectional view showing a structure of an APD according to afirst embodiment of the present invention;

FIGS. 6A to 6D are sectional views showing the steps in manufacturingthe APD shown in FIG. 5;

FIG. 7 is a sectional view showing a structure of an APD according to asecond embodiment of the present invention;

FIG. 8 is a sectional view showing a structure of an APD according to athird embodiment of the present invention;

FIGS. 9A to 9D are sectional views showing the steps in manufacturingthe APD shown in FIG. 8;

FIGS. 10A to 10C are sectional views showing examples in which aposition of masking layer for forming a light detecting region isvaried;

FIG. 11 is a sectional view showing a structure of the APD obtained whena part of a masking layer for forming a guard ring also serves as a partof a masking layer for forming a light receiving layer;

FIG. 12 is a sectional view showing a structure of an APD according to afourth embodiment of the present invention;

FIGS. 13A and 13B are sectional views showing abnormal growth inselective deposition or crystal growth to form an annular semiconductorlayer; and

FIGS. 14A and 14B are sectional views showing a structure for preventingthe abnormal growth shown in FIGS. 13A and 13B.

DETAILED DESCRIPTION OF THE PREFERRED EMBODIMENTS

Various preferred embodiments according to the present invention will bedescribed hereinafter with reference to the accompanying drawings.

FIG. 5 is a sectional view showing a schematic structure of an APDaccording to a first embodiment of the present invention. In FIG. 5,reference numeral 21 denotes an n-InP substrate. On the substrate 21, ann-InP buffer layer 22 (carrier concentration: 5×10¹⁶ cm⁻³ or less;thickness: 0.5 μm), an n⁻ -GaInAs light absorption layer 23 (carrierconcentration: 1×10¹⁵ cm⁻³ ; thickness: 2 μm), an n-GaInAsP intermediatelayer 24 (absorption edge wavelength: 1.3 μm; carrier concentration:2×10¹⁶ cm⁻³ thickness: 0.4 μm), an n-InP multiplication layer 25(carrier concentration: 4×10¹⁶ cm⁻³ ; thickness: 0.8 μm), and an n⁻ -InPlayer 26 (carrier concentration: 1×10¹⁵ cm⁻³ ; thickness: 1.2 μm) aregrown. In addition, an annular GaInAsP spacing layer 27 (absorption edgewavelength: 1.3 μm; undoped; thickness: 0.2 μm) is grown on the n⁻ -InPlayer 26. In the InP layer 26, a p-type region (guard ring) 28 is formedby implanting Be ions, and a p-type region (light detecting region) 29is formed by diffusing Cd or Zn ions. An insulating film 31, anon-reflection film 32, and an electrode 33 are formed on an uppersurface of the above structure, and an electrode 34 is formed on a lowersurface of the n-InP substrate. Note that the insulating film 31 and thenon-reflection film 32 consist of silicon nitride films, and theelectrodes 33 and 34 consist of AuZn and AuGe, respectively.

The conditions for Be ion implantation to form a moderately graded p-njunction is as follows. That is, the Be ions are implanted at anaccelerated energy of 200 keV and a dose of 1×10¹³ cm⁻². After the ionimplantation, annealing is performed at 700° C. for 20 minutes. In thediffusion of Cd or Zn to form a steeply graded p-n junction, e.g., vapordiffusion of Cd is performed at 560° C. for 20 minutes by a closedampule (10 cc, 1×10⁻⁶ Torr at a room temperature) method using Cd₃ P₂(20 mg) as a source. Therefore, the central diffusion front of the lightdetecting region 29 is extremely close to the n-InP layer 25, and thedepth of the peripheral diffusion front is smaller than that of thecentral portion. The diffusion from of the guard ring 28 is definedbetween the central and peripheral portions of the diffusion front ofthe light detecting region 29. For example, an MOCVD method is employedas a crystal growth method of the layers 22 to 27. According to thismethod, the crystal is grown at 620° C.

With such a structure, a sufficient avalanche break down voltage ofabout 60 V and a sufficient guard ring breakdown voltage of 80 V or morecan be obtained. A dark current of the element in the light detectingregion having a diameter of 50 μm is 10 nA or less, thus obtaining anexcellent APD.

In the above-mentioned APD shown in FIG. 5, by forming the annularsemiconductor spacing layer 27 on the flat semiconductor multi-layerfilm, the junction depth of the peripheral portion of a steeply gradedp-n junction can be decreased, as compared with that of the centralportion, by a depth substantially corresponding to the thickness of thespacing layer 27. A sufficient guard ring effect can be obtained whileflatness of the surface of the semiconductor multi-layer film is keptwithout a guard ring having a large junction depth. Therefore, a guardring breakdown voltage can be improved, and a dark current can bedecreased.

A method of manufacturing the above-mentioned APD shown in FIG. 5 willbe described hereinafter with reference to FIGS. 6A to 6D.

As shown in FIG. 6A, the above-mentioned layers 22 to 27 are formed onthe n-InP substrate 21 by crystal growth. Then, as shown in FIG. 6B, anSiO₂ film 35 having a thickness of about 8,000Å is formed on the GaInAsPspacing layer 27, and an annular window 35a is formed on the SiO₂ film35. In order to form this window 35a, a resist pattern (not shown) isformed on the SiO₂ film 35, and etching is performed for about oneminute using the resist pattern as a mask and using an NH₄ F aqueoussolution as a etchant. Using the SiO₂ film 35 having the window 35 as amask, Be ions are implanted in an annular region having an innerdiameter of 55 μm, and an outer diameter of 80 μm. Then, annealing isperformed. Therefore, a p-type region (guard ring) 28 is formed in theInP layer 26.

As shown in FIG. 6C, then, the SiO₂ film 35 is removed. Thereafter, theGaInAsP spacing layer 27 is etched to form an annular layer whichpartially overlaps the window and has a diameter slightly smaller thanthat of the window. In this etching, after the resist mask is formed onthe spacing layer 27, the resultant spacing layer 27 may be selectivelyetched at 26° C. for about one minute using an etching solution obtainedby mixing sulfuric acid, a hydrogen peroxide aqueous solution, and waterat a ratio of 4:1:1, in the order named.

As shown in FIG. 6D, the silicon nitride film 31 is deposited on theentire surface by plasma CVD. Thereafter, a circular diffusion windowhaving a diameter of 60 μm is formed on the silicon nitride film 31.That is, the portion of the silicon nitride film 31, which is on thespacing layer 27 excluding the peripheral portion and surrounded by thespacing layer 27, is removed. Thermal diffusion of Cd or Zn is performedto form the p-type region (light detecting region) 29. At this time, asshown in FIG. 6D, the central diffusion front of the light detectingregion 29 is extremely close to the n-InP layer 25, and the peripheraldiffusion front of the light detecting region 29 is away from the layer25 due to the presence of the spacing layer 27. In addition, byselecting an appropriate thickness of the spacing layer 27, the depth ofthe central diffusion front of the light detecting region 29 can belarger than that of the diffusion front of the guard ring 28, and thedepth of the peripheral diffusion front of the light detecting region 29can be smaller than that of the diffusion front of the guard ring 28.Thereafter, the non-reflection film 32, the electrodes 33, 34, and thelike are formed, so that the device shown in FIG. 5 is obtained.

In the APD thus manufactured, since the depth of the peripheraldiffusion front of the light detecting region 29 is smaller than that ofthe central diffusion front of the region 29, the depth of the diffusionfront of the guard ring 28 can be larger than that of the peripheraldiffusion front of the light detecting region 29 without extending intothe n-InP layer 25. Therefore, a sufficient guard ring breakdown voltagecan be obtained and a dark current can be minimized. In this case, onlysingle crystal growth is required in the manufacturing steps, and thekind of growth technique is not limited. In the light detecting region29, a difference between the depth of the central diffusion front andthat of the peripheral diffusion front is defined by the thickness ofthe spacing layer 27. Therefore, excellent controllability can beobtained as compared with a method of processing the InP layer 26 byetching or ion milling. In addition, the crystal surface issubstantially flat, and sufficient flatness can be kept as a planar typedevice. Therefore, the excellent device characteristics are obtained,and simple manufacturing and mounting are effectively performed.

FIG. 7 is a sectional view showing a schematic arrangement of an APDaccording to a second embodiment of the present invention. The samereference numerals in FIG. 7 denote the same parts as in FIG. 5, and adetailed description thereof will be omitted.

A difference between the above-mentioned embodiment and this embodimentis that Be ions are implanted in the entire surface of a p-n junctionregion to form a guard ring in this embodiment. More specifically, ionsare not implanted in an annular region, but are implanted in a circularregion 48 having a diameter larger than that of a light detecting region29. Only a change in pattern, i.e., removal of the central portion ofthe ion-implantation mask is required to allow the ion implantation tothe entire surface of the p-n junction region.

The Be ions are implanted in the entire surface in this embodiment.However, in the central region, the depth of a moderately graded p-njunction obtained by implanting Be ions is smaller than that of asteeply graded p-n junction obtained by implanting Cd or Zn, so that theelement characteristics are little affected. A feature of thisembodiment is as follows. That is, the overlap margin of the guard ringformed by diffusion of Be ions and the light detecting region formed bydiffusion of Cd or Zn is increased to allow a decrease in size of thepattern, so that the entire p-n junction area is reduced, thusdecreasing a parasitic capacitance.

FIG. 8 is a sectional view showing a schematic structure of an APDaccording to a third embodiment of the present invention. In FIG. 8,reference numeral 51 denotes an n-Inp substrate. On the substrate 51, ann-InP buffer layer 52, an n⁻ -GaInAsP light detecting layer 53 (having acomposition lattice-matched with InP), an n⁻ -GaInAsP first intermediatelayer 54a (absorption wavelength: 1.3 μm), an n⁻ -GaInAsP secondintermediate layer 54b (absorption wavelength: 1.1 μm), an n-InPavalanche multiplication/electric field relaxation layer 55, an n⁻ -InPwindow layer 56 are grown and formed, and an annular semiconductorspacing layer 57 in formed thereon. The spacing layer 57 consists of,e.g., InP. The spacing layer 57 may be a crystal of GaInAsP, GaInAs, orthe like. When the composition and thickness of the spacing layer 57 maybe changed depending on the structure design and process conditions. Thetwo intermediate layers are used in this embodiment unlike the aboveembodiments in order to decrease the discontinuity of the band gapbetween the light detecting layer 53 and the electric relaxation layer55.

The concentration and thickness of each semiconductor layer aredetermined as follows. For example, the buffer layer 52 has aconcentration of 4×10¹⁶ cm⁻³ and thickness of 0.5 μm, the lightabsorption layer 53 has a concentration of 5×10¹⁵ cm⁻³ or less and athickness of 2 μm, each of the first and second intermediate layers 54aand 54b has a concentration of 5×10¹⁵ cm⁻³ and a thickness of 0.1 μm,the avalanche multiplication/electric field relaxation layer 55 has aconcentration of 4×10¹⁶ cm⁻³ and a thickness of 0.9 μm, the window layer56 has a concentration of 5×10¹⁵ cm⁻³ or less and a thickness of 1 μm,and the spacing layer 57 has a concentration of 5×10¹⁵ cm⁻³ or less anda thickness of 0.4 μm.

Portions except for the semiconductor layers will be described below.Reference numeral 58 denotes a p-type region (guard ring) formed byimplanting Be ions to define a moderately graded p-n junction; 59, ap-type region (light detecting region) formed by thermal diffusion of Cdto define a steeply graded p-n junction; 61, a passivation film (e.g., asilicon nitride film: thickness of 2,000Å); 62, a non-reflection coatinglayer; and 63 and 64, electrodes (e.g., Ti/Pt/Au: 1,500/500/5,000Å, andArGe/Au: 2,000/5,000Å). Be in the p-type region 58 and Cd in the lightdetecting region 59 can be replaced by other acceptor impurities (e.g.,Mg or Zn), or a means for doping the impurities may be replaced.

Although the structure of this device is substantially the same as thatin the first embodiment, the method of manufacturing the device in thisembodiment is largely different from that in the first embodiment. FIGS.9A to 9D are sectional views showing the steps in manufacturing thedevice shown in FIG. 8. One side of the guard ring is shown in FIGS. 9Ato 9D, and the semiconductor layers below the n-InP layer 55 areomitted. The detailed structure elements of the layers are the same asin FIG. 8.

As shown in FIG. 9A, crystal growth of the semiconductor layers 52 to 56shown in FIG. 8 is performed. For example, an MOCVD method is used as acrystal growth method. This crystal growth is performed at 620° C. Then,e.g., an SiO₂ film 65 having a thickness of 1 μm is formed on the n⁻-InP layer 56 as a mask for performing selective crystal growth and ionimplantation. An annular window 65a corresponding to a guard ringportion is formed. The annular window 65a has an inner diameter of,e.g., 40 μm and an outer diameter of, e.g., 60 μm. The annular window65a is formed by normal photolithography and wet etching using an NH₄ Faqueous solution. Using the MOCVD again, the InP spacing layer 57 isselectively grown in the annular window 65a formed in the SiO₂ mask 65.At this time, although a polysilicon substance 57' is often precipitatedon the mask 65 depending on the crystal growth conditions, it can bedisregarded in this case. A refractory material having an ultimateconductivity wherein an impurity can be diffused can be employed as thematerial of the spacing layer 57. Therefore, an amorphous layer may beused as the spacing layer. As for the manufacturing method, depositionmay be performed by sputtering or CVD.

As shown in FIG. 9B, a Be ion implantation region 58' is formed by ionimplantation. The implantation conditions are as follows. For example,the ion implantation is performed at an accelerated voltage of 200 keVand a dose of 1×10¹³ cm⁻².

As shown in FIG. 9C, the mask 65 is then removed. Thereafter, a thermaltreatment (crystal annealing) is performed in an atmosphere containingextra P. The mask 65 may be removed using an HF aqueous solution or anNH₄ F aqueous solution. For example, annealing is performed in anatmosphere of an H₂ gas containing PH₃ of 10,000 ppm at 750° C. for 10minutes after the mask 65 is removed. Note that this annealing may beperformed while the mask 65 remains. Another cover mask (e.g., a glasslayer consisting of PSG or ASG) may be formed after the mask 65 isremoved, and so-called cap annealing may be performed.

By the above steps, the annular projection 57 obtained by selectivecrystal growth and the p-type region (guard ring) self-aligned therewithare formed. One photoetching process is performed before this step. Notethat the diffusion front of the guard ring 58 is located near theinterface between the layers 55 and 56.

Thereafter, as shown in FIG. 9D, the mask 61 for thermal diffusion of Cdis deposited by plasma CVD, and a window of the light detecting region(Cd diffusion portion) is formed by normal photolithography and dryetching using a CF₄ gas. The mask 61 finally remains as a passivationfilm. The mask 61 need not be formed in this step. The ion implantationand selective growth mask 65 having a two-layer structure of a siliconnitride layer (2,000Å) and an SiO₂ layer (8,000Å) may be formed in thestep shown in FIG. 9B, and the SiO₂ layer may be selectively removed byetching using an NH₄ F aqueous solution after the ion-implantationprocess. At this time, the silicon nitride film formed on the innerperipheral portion and the interior of the annular projection is removedby photolithography.

Sequentially, using Cd₃ P₂ as a diffusion source, for example, thethermal diffusion is performed at 560° C. for 10 minutes to diffuse Cd,thus forming the p-type region (light detecting region 59). At thistime, due to the presence of the spacing layer 57, the depth of thecentral diffusion front of the light detecting region 59 is smaller thanthat of the peripheral diffusion front of the region 59. After thisstep, by forming the nonreflection coating film 62 and the electrodes 63and 64, the above-mentioned structure shown in FIG. 8 can be realized.

Although the pattern is self-aligned before the step in FIG. 9C,photolithography is performed again in the step in FIG. 9D. Therefore,the self-alignment of the pattern may undesirably tends to be lost.However, the self-alignment is not substantially lost in thisembodiment, as shown in FIGS. 10A to 10C. FIGS. 10A to 10C correspond tothe above-mentioned step shown in FIG. 9D, and show a case wherein theposition of the window o the light detecting region (Cd diffusionportion) in the Cd thermal diffusion mask 61 is gradually shiftedrelatively to the annular spacing layer 57. As is understood from FIGS.10A to 10C, the pattern shift can hardly affect the element structurewhen the shift width does not exceed the width of the firstly formedannular window.

More specifically, as shown in FIGS. 10A to 10C, even if the position ofthe mask pattern 61 is shifted, a position at which a deformed region ofthe Cd diffusion overlaps the guard ring 58 is not changed, and a widthat which the deep portion (bottom of the step) of the Cd diffusion frontportion overlaps the guard ring 58 (i.e. a distance between the inneredge of the guard ring 58 and the stepped portion of the Cd diffusionregion) is also kept constant. Therefore, the amount of dark currentwhich tends to be generated in a region wherein the Cd diffusion frontportion overlaps the guard ring is also kept constant. In addition,since the overlapping width is small, an absolute value of the darkcurrent is also small as compared with that in the conventional guardring structure. Note that when the Cd diffusion mask 61 also serves asthe first ion implantation mask, as described above, the Cd diffusionregion includes the entire regions below the annular projection, and theouter periphery substantially coincides with the outer periphery of theannular projection, and is self-aligned. The structure of the devicethus obtained is shown in FIG. 11.

According to the above-mentioned method of forming a spacing layer byselective growth using a mask having an annular window, since theannular window of the mask also serves as a mask window for the impurityimplantation of the moderately graded junction (guard ring), theirpositions are self-aligned. In addition, when a impurity for forming asteeply graded junction is doped, the steeply graded junction isdeformed in the inner periphery of the semiconductor spacing layerobtained by selective growth. Therefore, the positions of the innerperiphery of the guard ring and the steeply graded junction deformedportion are self-aligned. Therefore, an overlap margin of the patternsof the semiconductor spacing layer and the guard ring is not required ascompared with a case wherein the semiconductor spacing layer and theguard ring are individually formed, so that the area of the p-n junctionis reduced and the parasitic capacitance of the element can be decreasedwithout degrading the guard ring performance. In addition, since thedepth of the crystal growth of the semiconductor spacing layer isrelatively small, an increase in cost caused by the crystal growth iscancelled by a decrease in steps of the mask alignment and an increasein yield of the elements achieved by providing a self-alignment process.Therefore, a precision of the projection step can be improved by thecrystal growth, and hence the performance and reproducibility of thedevices are improved, thus effectively improving the entire costperformance.

FIG. 12 is a sectional view showing a schematic structure of an APDaccording to a fourth embodiment of the present invention. The samereference numerals in FIG. 12 denote the same parts as in FIG. 8, and adetailed description thereof will be omitted.

In this embodiment, a bonding pad region is formed in the structureshown in FIG. 8 to perform wire-bonding. The bonding pad of the opticalcommunication APD often has an area substantially equal to the p-njunction area of the element, and the parasitic capacitance of thebonding pad tends to cause a problem. Therefore, the thickness of aninsulating film below the bonding pad is normally increased or a guardring often extends below the bonding pad. FIG. 12 shows the latterexample wherein a dark current is improved as compared with the normalcase.

More specifically, two layers 57 and 67 are formed by selective crystalgrowth in the step shown in FIG. 9B in this embodiment, and the secondlayer 67 except for the bonding pad is selectively removed before theion implantation step. Then, the following processes are performed inthe same manner as in FIGS. 9C and 9D, thus obtaining the structureshown in FIG. 12. In the bonding pad portion, the junction depths of Bemoderately graded junction and Cd steeply graded junction are small. Forthis reason, an electric field value is not unnecessarily increased in alight absorption layer 53 below the bonding pad, and an increase in darkcurrent due to an increase in guard ring area can be suppressed.

FIGS. 13A, 13B, 14A, and 14B show an improved example for preventingabnormal growth which tends to occur in the selective growth step inFIG. 9B. In this selective growth, a crystal material which has reacheda portion covered with the mask performs thermal motion on the masksurface. The crystal material stays in a low-energy region on the masksurface or is reevaporated from the mask surface to perform energystorage. Therefore, in the original selective crystal growth whereinpolycrystalline substances are not precipitated on the mask surface, itis preferable that all the crystal materials are reevaporated from themask surface. However, when an average free stroke of the crystalmaterial on the mask surface is long, the crystal material often moveson the mask to reach the mask interface. The crystal material which hasreached the mask surface is supplied to the underlying crystal on themask interface as an extra crystal material. In the crystal growth suchas MOCVD depending on a flow of a gas in a vapor phase, a depositionmaterial flow tends to be temporarily discontinued or stopped at themask interface. An increase in concentration of the crystal materialmolecules occurs or the moving molecules on the mask surface areundesirably drawn at the mask interface.

When the above situations are complex and related to each other to causeabnormal growth and, in particular, when the surface orientationdependency of the crystal is present, the projection shown in FIGS. 13Aand 13B tends to be grown. FIGS. 13A and 13B show an example wherein theselective crystal growth is performed on the (001) surface of the InPsubstrate. This growth occurs in the <110> and <110> crystal orientationdirections. Such abnormal growth causes a fault in photolithography, orpoor or degraded device characteristics.

FIGS. 14A and 14B show a method of solving the above problems. In FIGS.14A and 14B, the selective crystal growth mask has a two-layerstructure. For example, a selective crystal growth mask is obtained bystacking a silicon nitride film 68 on an SiO₂ film 65. For example, theSiO₂ film 65 has a thickness of 8,000Å and the silicon nitride film 68has a thickness of 2,000Å. First, the silicon nitride film 68 ispatterned by dry etching. Then, the SiO₂ film 65 is patterned by an NH₄F aqueous solution and an overhang of the silicon nitride film 68 isformed utilizing a difference of the etching rates between the SiO₂ film65 and the silicon nitride film 68. Thereafter, selective crystal growthis performed to allow crystal growth without growth of a projection, asshown in FIGS. 14A and 14B. This crystal growth can be performed becausethe molecules which have moved on the mask surface are easily vapored atthe overhang. Even though slight abnormal growth is recognized, extremeprojection growth can hardly occur. At this time, if the thickness ofthe crystal growth on the mask interface may become large or small, thethickness may be optimized in accordance with the conditions of thefollowing process. Even if a mask having a three-layer structureobtained by combining the above-mentioned method using the SiO₂ film onthe silicon nitride film is employed, this method can be similarlyperformed. Even if a mask material is changed, this method can beutilized.

The present invention is not limited to the above embodiments, andvarious changes and modifications may be made without departing from thespirit and scope of the invention.

More specifically, although the multi-layer structure consisting ofInP-GaInAs-GaInAsP is employed in this embodiment, the present inventionis not limited thereto, and a proper change may be made in accordancewith the technical specifications. For example, a multi-layer structureconsisting of InP-GaInAs-AlInAs, or Si-SiGe-Si can be employed.

The material of the spacing layer is not limited to a single crystal ofGaInAs, GaInAsP or InP, and polycrystalline or amorphous deposit or theother material such as AlGaAs and AlInAs can be employed. In addition,although semiconductor layers of an n conductivity type are formed inthe above embodiments, p-type semiconductor layers can be formed. Inthis case, the guard ring and light detecting region have the nconductivity type. Si, Sn or the like can be used as an n-type impurity.

As has been described above in detail, according to the presentinvention, in a steeply graded p-n junction, the peripheral junctiondepth is smaller than the central junction depth. Therefore, asufficient guard ring effect can be obtained while surface flatness ofthe semiconductor multi-layered film is kept. Therefore, a highbreakdown voltage of a guard ring can be obtained and a dark current canbe minimized. As a result, a high manufacturing yield can be realizedwith on increase in the manufacturing cost.

What is claimed is:
 1. A method of manufacturing a semiconductor lightdetector, comprising the steps of:forming a guard ring by doping animpurity of a second conductivity type in a surface region of a firstsemiconductor layer of a first conductivity type having a multi-layerstructure including a light absorbing layer and an avalanchemultiplicating layer, said guard ring defining a first p-n junction;forming an annular second semiconductor layer on a surface of said firstsemiconductor layer corresponding to said guard ring; forming a maskinglayer on a peripheral portion of said second semiconductor layer and asurface of said first semiconductor layer outside said peripheralportion; and forming a light detecting region by doping an impurity of asecond conductivity type in said first semiconductor layer, using saidmasking layer as a mask, in such a manner that the diffusion depth of acentral portion of said first semiconductor layer is greater than thatof said guard ring, and the diffusion depth of a peripheral portion ofsaid first semiconductor layer is less than that of said guard ring,said light detecting region defining a second p-n junction having aconcentration gradient higher than that of the first p-n junction.
 2. Amethod according to claim 1, wherein said second semiconductor layer isformed by patterning a third semiconductor layer formed over an entiresurface of said first semiconductor layer.
 3. A method according toclaim 2, wherein said second semiconductor layer is formed to be smallerthan the outer periphery of said guard ring.
 4. A method according toclaim 1, wherein a window layer is formed on said avalanchemultiplicating layer to serve as a surface layer of said firstsemiconductor layer, and said light detecting region and said guard ringare formed on said window layer.
 5. A method according to claim 1,wherein said guard ring is formed such that the junction depth of saidguard ring is less than that of a central portion of said lightdetecting region.
 6. A method according to claim 1, wherein said guardring is formed such that the junction depth of said guard ring isgreater than that of a central portion of said light detecting region.7. A method according to claim 4, wherein said guard ring is formed suchthat the junction depth of said guard ring is equal to the thickness ofsaid window layer.
 8. A method according to claim 1, wherein saidspacing layer consists of a conductive material in which an impurity canbe diffused.
 9. A method according to claim 8, wherein said conductivematerial is selected from the group consisting of InP, GaInAsP, GaInAs,AlInAs and AlGaAs.
 10. A method according to claim 4, wherein said lightabsorbing layer consists of GaInAsP or GaInAsP, and said avalanchemultiplicating layer and said window layer consist of InP.
 11. A methodaccording to claim 4, wherein said light absorbing layer consists ofSiGe, and said avalanche multiplicating layer and said window layerconsist of Si.
 12. A method according to claim 1, wherein said secondsemiconductor layer is of two-layer structure.
 13. A method according toclaim 1, wherein said guard ring is formed by formation of said maskinglayer, including an annular window, on said first semiconductor layer,and doping of an impurity of a second conductivity type in said firstsemiconductor layer, using said masking layer as a mask.
 14. A methodaccording to claim 1, wherein said guard ring is formed by formation ofsaid masking layer, including a circular window, on said firstsemiconductor layer, and doping of an impurity of the secondconductivity type in said first semiconductor layer, using said maskinglayer as a mask.
 15. A method of manufacturing a semiconductor lightdetector, comprising the steps of:forming a first mask layer, includingan annular window, on a surface of a first semiconductor layer of afirst conductivity type having a multi-layer structure including a lightabsorbing layer and an avalanche multiplicating layer; selectivelyforming a spacing layer on said first semiconductor layer, said firstsemiconductor layer being exposed through said annular window; doping animpurity of a second conductivity type in a surface region of said firstsemiconductor layer, through said spacing layer, to form a guard ring,said guard ring defining a first p-n junction; forming a second maskinglayer on a surface of said first semiconductor layer outside said secondsemiconductor layer; and forming a light detecting region by doping animpurity of the second conductivity type in said first semiconductorlayer, using said second masking layer as a mask, in such a manner thatthe diffusion depth of a central portion of said first semiconductorlayer is greater than that of said guard ring, and the diffusion depthof a peripheral portion of said first semiconductor layer is less thanthat of said guard ring, said light detecting region defining a secondp-n junction having a concentration gradient higher than that of thefirst p-n junction.
 16. A method according to claim 15, wherein saidsecond masking layer is formed to cover an outer periphery of saidsecond semiconductor and said first semiconductor layer formed outsidesaid second semiconductor layer after said masking layer is removed. 17.A method according to claim 15, wherein said second masking layer isformed by removing a portion of said first masking layer surrounded bysaid window.
 18. A method according to claim 17, wherein said firstmasking layer is of two-layer structure, the upper layer of thetwo-layer structure being removed after said guard ring is formed.
 19. Amethod according to claim 15, wherein said first masking layer is oftwo-layer structure and an upper layer on said window extends as anoverhang.
 20. A method according to claim 15, wherein a window layer isformed on said avalanche multiplicating layer to serve as a surfacelayer of said first semiconductor layer, and said light detecting regionand said guard ring are formed on said window layer.
 21. A methodaccording to claim 15, wherein said guard ring is formed such that thejunction depth of said guard ring is less than that of a central portionof said light detecting region.
 22. A method according to claim 15,wherein said guard ring is formed such that the junction depth of saidguard ring is greater than that of a central portion of said lightdetecting region.
 23. A method according to claim 20, wherein said guardring is formed such that the junction depth of said guard ring is equalto the thickness of said window layer.
 24. A method according to claim15, wherein said spacing layer consists of a conductive material inwhich an impurity can be diffused.
 25. A method according to claim 24,wherein said conductive material is selected from the group consistingof InP, GaInAsP, GaInAs, AlInAs and AlGaAs.
 26. A method according toclaim 20, wherein said light absorbing layer consists of GaInAsP orGaInAsP, and said avalanche multiplicating layer and said window layerconsist of InP.
 27. A method according to claim 20, wherein said lightabsorbing layer consists of SiGe, and said avalanche multiplicatinglayer and said window layer consist of Si.